JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs

2026-01-26 - 17:56

SHENZHEN, China, Jan. 26, 2026 /PRNewswire/ — JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable integration of high-frequency materials (such as Rogers or Taconic) with standard FR-4 within a single multilayer board, directly addressing the cost pressures of mass-market 5G